1. Overview of Equipment and Application Fields

The standard programmable servo adhesive dispensing machine AC200-SE is a high-precision fully automated spin coating system specifically engineered for semiconductor lithography, microelectromechanical systems (MEMS), photovoltaic cells, and advanced material development. Powered by precision servo motors and integrated with an industrial-grade PLC control system, it achieves ultra-accurate control over rotational speed, acceleration, and timing. Featuring a solvent-resistant HDPE inner chamber and a transparent PC explosion-proof cover, the machine ensures chemical compatibility while enabling real-time monitoring of the coating process. The AC200-SE supports substrate sizes ranging from fragments to 8-inch wafers, with advanced features including bidirectional operation, automatic dispensing, edge bead removal (EBR), and backside cleaning. Its compact design allows embedded installation in glove boxes, making it ideal for water-sensitive material preparation. Widely used in uniform deposition of photoresist coatings, sol-gel films, organic light-emitting diodes (OLEDs), perovskite solar cells, and various functional nanofilms.

2. Core Functional Highlights

· High Precision Servo Drive and Excellent Uniformity

o Servo motor control: Equipped with imported high-precision servo motors, featuring a speed range of 20-10000 rpm and adjustable precision up to 1 rpm, with actual operational accuracy maintained within **±1 rpm**.

o Ultra-high acceleration: The acceleration is continuously adjustable within the range of 20-50,000 rpm/s, enabling rapid attainment of the set speed. This effectively reduces the flow time of the adhesive solution and enhances the uniformity and repeatability of the film.

o Excellence in film thickness data: Field measurements demonstrate that applying AZ1500 photoresist (20CP) on 8-inch wafers achieves film thickness uniformity of ±0.92% within a wafer and ±1.10% between wafers. For 4-inch wafers, the RZJ304 photoresist solution exhibits even better uniformity at ±0.49% within a wafer, ensuring high reliability of experimental data.

· Intelligent Program Control and Human-computer Interaction

o PLC Central Control: Featuring an industrial-grade PLC controller with built-in functionality, it ensures stable operation and strong anti-interference capabilities.

o 7-inch full-color touchscreen: Features a large-sized color touchscreen with a user-friendly interface and intuitive operation. Users can easily set multiple process parameters.

o Powerful programming capabilities: Supports 100 process program sets, each editable with 100 steps, meeting complex and variable adhesive application requirements. Single-step duration up to 3000 seconds, with a time resolution of 0.1 seconds.

· Flexible configuration and automated scaling

o Multi-specification vacuum loading trays: Featuring three standard sizes (10mm, 25mm, and 2 inches) with interchangeable suction cups, these trays seamlessly accommodate substrates ranging from fragments to 8-inch circular specimens.

o Automatic dispensing system: Featuring four standard dispensing ports, it supports seamless switching and precise metering of multiple adhesive types, with expandable port capacity for fully automated operation.

o Advanced Process Module: Optional edge-bonding removal (EBR) function to eliminate excess adhesive layers at wafer edges, preventing lithography alignment errors; optional back cleaning module to maintain wafer surface cleanliness; customizable splash-proof hood cleaning and developing functions for one-stop process integration.

· Durable Design and Safe Operation

o Solvent-resistant chamber: The interior is constructed with high-density polyethylene (HDPE), which exhibits exceptional resistance to acid, alkali, and organic solvent corrosion, thereby extending the equipment's service life.

o Transparent safety cover: The top cover is made of solvent-resistant PC material, offering high transparency for easy observation of the spin-coating process while providing splash protection.

o Forward/reverse function: Unique motor control for bidirectional operation, ideal for specialized process requirements or auxiliary cleaning.

o Glove box compatibility: The device features a compact structure with customizable height, enabling embedded installation within the glove box. This design reduces operational height and facilitates the preparation of sensitive materials under inert gas protection.

3. Technical Parameters and Specifications

4. Typical Application Scenarios

· Semiconductor lithography process: Uniformly deposit positive/negative photoresists on substrates such as silicon wafers and GaAs, used for IC manufacturing and MEMS device fabrication.

· Photovoltaic cell development: Coating perovskite precursor solutions, electron transport layer, and hole transport layer to fabricate high-efficiency solar cells.

· Flat panel display and OLED: The process involves coating organic light-emitting materials, insulating layers, or planarization layers onto a glass substrate.

· Functional thin films: Oxide films, nanoparticle coatings, biosensor sensitive films prepared by sol-gel method.

· Research institutions and pilot lines: Suitable for small-batch, multi-variety film preparation in university laboratories, research institutes, and corporate R&D centers, as well as process validation requiring high reproducibility data.

· Operation in a glove box: For water and oxygen-sensitive organic semiconductors and perovskite materials, the adhesive is applied directly in the glove box without water or oxygen.

5. Why choose the standard-range programmable servo glue homogenizer AC200-SE?

The standard programmable servo film homogenizer AC200-SE serves as an ideal bridge connecting laboratory R&D and small-scale production, featuring industrial-grade stability, ultra-precision servo drive, and flexible modular design. Its ±1 rpm speed control and acceleration up to 50,000 rpm/s ensure extreme film thickness uniformity and process reproducibility, significantly reducing experimental errors. With 100 sets × 100-step powerful programming capability and four-channel automatic dispensing**, it simplifies complex processes into efficient operations. Whether handling fragments or 8-inch wafers, whether performing routine coating or advanced processes requiring edge removal and backwashing, the AC200-SE handles them with ease. Its solvent-resistant design and glovebox compatibility meet stringent experimental environment requirements. Choosing the AC200-SE means selecting an efficient, precise, and reliable film preparation solution to achieve outstanding results in micro/nano manufacturing.